MIFIIPI55E10HI00

Description

Product Name: GE MIFIIPI55E10HI00

Product Description:

The GE MIFIIPI55E10HI00 is a high-performance metal-clad leadless chip carrier (MLCC) package. It is designed for surface-mount applications in the electronics industry. The package provides excellent electrical and thermal performance, making it suitable for a range of demanding applications in consumer electronics, industrial equipment, and other systems.

Product Parameters:

MIFIIPI55E10HI00

Package Type: Metal-Clad Leadless Chip Carrier (MLCC)
Pin Count: 55 pins
Body Material: High-performance thermoplastic
Outer Case Material: Metal
Soldering Temperature: 260°C
Thermal Rating: 175°C
RoHS Compliant: Yes

Specification:

MIFIIPI55E10HI00

Excellent Electrical Performance: High signal speed and low noise characteristics.
Robust Thermal Management: Metal-clad design provides effective heat dissipation.
High Pin Count: Offers a high number of pins for increased functionality.
Compact Size: Small footprint suitable for dense circuit board layouts.
High Reliability: Designed for long-term reliability in demanding applications.
Easy Surface Mounting: Designed for automated assembly processes.
Wide Temperature Range: Capable of operating in a wide range of temperatures (-55°C to 175°C).

Note: The GE MIFIIPI55E10HI00 is a product example and may not be currently manufactured. It’s just an example of a metal-clad leadless chip carrier package for surface-mount applications.

MIFIIPI55E10HI00