GE MIFIIPI55E10HI00

Description

• Product Name: GE MIFIIPI55E10HI00
• Product Description: The GE MIFIIPI55E10HI00 is a high-performance metal-clad leadless chip carrier (MLCC) package. It is designed for surface-mount applications in the electronics industry. The package provides excellent electrical and thermal performance, making it suitable for a range of demanding applications in consumer electronics, industrial equipment, and other systems.
• Product Parameters:
• Package Type: Metal-Clad Leadless Chip Carrier (MLCC)
  Pin Count: 55 pins
  Body Material: High-performance thermoplastic
  Outer Case Material: Metal
  Soldering Temperature: 260°C
  Thermal Rating: 175°C
  RoHS Compliant: Yes
• Specification:
• Excellent Electrical Performance: High signal speed and low noise characteristics.
  Robust Thermal Management: Metal-clad design provides effective heat dissipation.
  High Pin Count: Offers a high number of pins for increased functionality.
  Compact Size: Small footprint suitable for dense circuit board layouts.
  High Reliability: Designed for long-term reliability in demanding applications.
  Easy Surface Mounting: Designed for automated assembly processes.
  Wide Temperature Range: Capable of operating in a wide range of temperatures (-55°C to 175°C).
• Note: The GE MIFIIPI55E10HI00 is a product example and may not be currently manufactured. It’s just an example of a metal-clad leadless chip carrier package for surface-mount applications.
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